Ciech Sarzyna

Adhesives

Resins for special applications - glue charges

Name Description Type Curing system Viscosity mPa·s Gelation time in min Flexural strength MPa Tensile strengt MPa Tensile modulus MPa Elongation at break % HDT °C
Polimal 144 B good miscibility with mineral fillers, contains amine accelerator tere R 300 - 400 2,5 - 5 100 60 3500 2 75

Adhesive systems

EPIDIAN Hardener Ratio/per 100 g resin Gelation time of the composition, temp. 25°C, sample 100 g [min] Epoxide number mol/100g (min-max) Viscosity at 25°C mPa∙s (min-max) Colour (Gardner) hydrolysable CL ppm max/content based on Remarks in the catalogue
Epidian 5 Z-1 12 33 0,48-0,51 20000-30000 High viscosity adhesive
Epidian 5 IDA 50 40 0,48-0,51 20000-30000 High viscosity adhesive, higher flexibility vs Z-1
Epidian 5 PAC 60-100 180 0,48-0,51 20000-30000 High viscosity adhesive, high flexibility depending on the amount of curing agent
Epidian 53 Z-1 10 60 min 0,41 900*-1500* Adhesive for metals, glass, ceramics, for flooding of capacitors, connectors, cables - low viscosity
Epidian 53 TFF A possibility of application in a humid environment with a temperature from 5° C, a faster version - low lightness
Epidian 57 Z-1 10 40 Adhesive for metal, glass, ceramics, leather, medium flexible - high viscosity
Epidian 57 TFF 22 22 13000-19000 Possible application in humid environment at temp. higher than 5° C, faster version - high viscosity
Epidian 62 Z-1 10 50 min 0,39 4000*-6500* Adhesive for metal, glass, ceramics, structural castings, electronic devices - medium viscosity
Epidian 62 IDA 40 80 4000*-6500* A more flexible system - medium viscosity
Epidian 430 ET 5 60 Putty with high chemical resistance for bonding and grouting, CE
Epidian 622 Z-1 12 180** Adhesive, white
Epidian 100 A one-component, permanent epoxy adhesive, heat cured at a temperature above 120°C
Epidian 101 0,19-0,23 Permanent epoxy adhesive, heat cured at a temperature above 120°C

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